Flaw detection technology is moving towards intelligence and digitization:
1. Digital imaging: DR (digital radiography) replaces conventional film, with imaging in seconds and real-time analysis — for example, raising the efficiency of integrated circuit package inspection by 50%.
2. Industrial CT scanning: A three-dimensional model reconstructed from two-dimensional images taken at multiple angles allows defect size to be measured accurately; the method is used to detect internal porosity in aircraft engine blades.
3. AI-assisted diagnosis: Deep learning algorithms automatically identify defects such as cracks and inclusions in X-ray images, reducing the human error rate to below 1%.
4. Multi-technology integration: Combining phased array ultrasonic and eddy current testing, for example, allows interlayer defects in composite materials to be detected simultaneously.